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Patent Searching and Data


Title:
STRUCTURE OF RUBBER SUPPORT MOLDING DIE
Document Type and Number:
Japanese Patent JP2003231147
Kind Code:
A
Abstract:

To provide a structure of a rubber support molding die which makes it possible to use a die widely corresponding to changes of the dimension and rubber quality of a rubber support and ensures the flatness of the side surface of the rubber support product, capable of preventing a defective dimension and flatness defect.

A rubber-outflow slit 13a to 13d, 14a to 14d having a required width, e.g. 0.5 to 1 mm, are formed at the ridge line part X1 to X4 of a spacer 8 with a lower die 4 and the ridge line part Y1 to Y4 at which the spacer 8 contacts with an upper molding plate 10. And, also, rubber reservoirs 15a to 15d, 16a to 16d, located upper and lower, with a required volume, interconnecting with the slit 13a to 13d, 14a to 14d, are formed at the upper molding plate 10 and the spacer 8.


Inventors:
SAITO SATOSHI
Application Number:
JP2002028438A
Publication Date:
August 19, 2003
Filing Date:
February 05, 2002
Export Citation:
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Assignee:
YOKOHAMA RUBBER CO LTD
International Classes:
E01D19/04; B29C43/18; B29C43/36; B29L9/00; B29L31/10; E01D101/00; (IPC1-7): B29C43/36; B29C43/18
Attorney, Agent or Firm:
Shinichi Ogawa (2 outside)