Title:
半導体デバイスの構造、及びその溶着封止方法
Document Type and Number:
Japanese Patent JP4905281
Kind Code:
B2
Inventors:
Yukito Sudo
Application Number:
JP2007190777A
Publication Date:
March 28, 2012
Filing Date:
July 23, 2007
Export Citation:
Assignee:
NEC
International Classes:
H01L23/02; B23K11/00; B23K11/14; B23K11/30; H01L23/04
Domestic Patent References:
| JP63145589U | ||||
| JP64075187A | ||||
| JP2001179460A |
Attorney, Agent or Firm:
Michio Nagai
Masao Sekiguchi
Takamasa Nakano
Masao Sekiguchi
Takamasa Nakano