Title:
STRUCTURE OF SOLDER DISK AND FORMATION OF SOLDER BALL
Document Type and Number:
Japanese Patent JP2590762
Kind Code:
B2
Abstract:
PURPOSE: To reduce man-hours required for forming solder balls on pads provided on a board by forming a stable solder ball by supplying only one solder disk or simultaneously forming solder balls having different sizes.
CONSTITUTION: Solder disks have curved surfaces on one side and the sizes of the disks are made larger than those of pads provided on a board. The solder disks are put in the holes 6 of a solder disk housing jig 5 and are attached to an adhesive sheet 7 by raising the disks by blowing air into the holes 6. Then the disks are transferred to the pads coated with flux and melted by reflow so that solder balls can be formed on the pads.
Inventors:
Kenichi Otake
Application Number:
JP29284394A
Publication Date:
March 12, 1997
Filing Date:
November 28, 1994
Export Citation:
Assignee:
NEC
International Classes:
B23K3/06; B23K35/40; H01L21/60; H05K3/34; (IPC1-7): H05K3/34; B23K3/06; B23K35/40; H05K3/34
Domestic Patent References:
| JP62123384U | ||||
| JP6235599Y2 |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)