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Title:
STYRENE-BASED RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2001064463
Kind Code:
A
Abstract:

To obtain a resin composition excellent in mold releasability and moldability in spite of a styrene-based resin and a polyphenylene ether-based resin contained as principal components.

This flame retardant styrene-based resin composition is prepared by including (C) 0.1-1 pts.wt. of a polyethylene wax and (D) 5-20 pts.wt. of an oligomer type aromatic phosphoric ester in 100 pts.wt. of a resin composition comprising (A) a styrene-based resin containing at least a rubber-modified styrene-based resin and (B) a polyphenylene ether-based resin in (80/20) to (95/5) weight ratio of the components (A)/(B). The resultant flame retardant styrene- based resin composition is used as a molding material, etc., for a toner cartridge container.


Inventors:
SEI TOSHIYA
MIYASATO RYOJI
Application Number:
JP24040599A
Publication Date:
March 13, 2001
Filing Date:
August 26, 1999
Export Citation:
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Assignee:
DAICEL CHEM
International Classes:
C08L25/04; C08K5/49; C08L23/00; C08L51/00; C08L71/12; C08L91/06; (IPC1-7): C08L25/04; C08K5/49; C08L23/00; C08L71/12; C08L91/06
Attorney, Agent or Firm:
Mitsuo Hokita