Title:
基板の製造方法、磁気ディスクの製造方法、及び研磨装置
Document Type and Number:
Japanese Patent JP7165832
Kind Code:
B2
Abstract:
During polishing of main surfaces of a substrate, an opening of a through hole through which a polishing liquid is supplied does not constitute an obstacle, and precision polishing of the substrate is realized. A method for producing a substrate including substrate polishing processing has a step of polishing main surfaces of a substrate with polishing pads while holding the substrate between an upper surface plate and a lower surface plate that are provided with the polishing pads and rotating the upper surface plate and the lower surface plate, and a step of, during polishing of the main surfaces, supplying a polishing liquid to an inner circumferential face of a center hole of the upper surface plate through which a central axis of rotation of the upper surface plate passes and allowing the polishing liquid to descend along the inner circumferential face, thereby supplying the polishing liquid between the substrate and the polishing pads through a gap between the upper surface plate and the lower surface plate. The inner circumferential face is provided with a descending velocity control means that suppresses descending velocity of the polishing liquid.
Inventors:
Nguyen, Thai Luong
Application Number:
JP2021557411A
Publication Date:
November 04, 2022
Filing Date:
March 26, 2019
Export Citation:
Assignee:
HOYA CORPORATION
International Classes:
B24B37/00; B24B1/00; B24B37/08; B24B37/28; B24B57/02; G11B5/73; G11B5/84
Domestic Patent References:
| JP2018200960A |
Foreign References:
| WO2015080295A1 |
Attorney, Agent or Firm:
Global IP Tokyo Patent Business Corporation
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