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Title:
SUBSTRATE CONVEYING METHOD AND SUBSTRATE CONVEYING DEVICE IN DEVELOPING DEVICE
Document Type and Number:
Japanese Patent JP2009146927
Kind Code:
A
Abstract:

To provide a substrate conveying method and a substrate conveying device in a developing device that suppress excessive development progressing before water displacement is completed, suppresses occurrence of a remaining trace of water by an air knife, and do not impair pattern quality.

In processes of a developing tank to a washing tank; initially, a developer 20 is applied to the front end portion of a substrate with a developer amount of D1 which is large, in the middle period, the developer 20 is applied to the front end portion and an end portion with a developer amount of D2 which is small, in the ending period, the developer 20 is applied to the front end portion with a developer amount of D2, and water displacement is started at from the front end portion where the developer amount is small. In conveyance of the substrate from the washing tank to an air knife; the conveyance is carried out in such a way that, initially, water is applied to the front end portion with a water amount of D1 which is large, in the middle, water is applied to the front end portion and the end portion with a water amount D2 that is small, in the ending period, water is applied to the front end portion with a water amount of D2 which is small, and discharge of water at the air knife is started at from the front end portion of the substrate where the water amount is small.


Inventors:
NAKADA HIROSHI
Application Number:
JP2007319416A
Publication Date:
July 02, 2009
Filing Date:
December 11, 2007
Export Citation:
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Assignee:
TOPPAN PRINTING CO LTD
International Classes:
H01L21/027; B05C13/02; B65G13/11; B65G39/12; B65G49/06; G03F7/30; H01L21/677