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Patent Searching and Data


Title:
SUBSTRATE CUTTER
Document Type and Number:
Japanese Patent JPH09267291
Kind Code:
A
Abstract:

To secure a stripperless substrate cutter that is composed of only both vertical cutter bodies and reduces the number of part items sharply, and simultaneously capable of effectively utilizing the whole surface of a wiring substrate as a mounted area of chip parts.

In this substrate cutter of a wiring substrate, it consists of a lower cutter edge 2 at the stationary side and an upper cutter edge 4 at the movable side oppositely set up in this lower cutter edge 2, and both these lower and upper edges 2 and 4 are composed of double-edge type cutter bodies with inclined edge surfaces 2a and 4a of the same angle, and in case of these vertical cutter edges 2 and 4, a lower edge cutter 2b and an upper edge cutter 4b are zero each in terms of overstroke in time of cutting the wiring substrate 5, therefore they are set up so as to be slightly off-centered, and thus plural spots of the wiring substrate 5 are simultaneously cut off by a plural pair of these cutter edges 2 and 4.


Inventors:
TAKIMOTO KENTARO
YAMASHITA YOSHIHIRO
MATSUNAGA HIDETO
Application Number:
JP8023196A
Publication Date:
October 14, 1997
Filing Date:
April 02, 1996
Export Citation:
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Assignee:
SONY CORP
International Classes:
B26D1/08; H05K3/00; (IPC1-7): B26D1/08
Attorney, Agent or Firm:
Hidekuma Matsukuma