SUBSTRATE DEFECT INSPECTION METHOD AND SUBSTRATE DEFECT INSPECTION SYSTEM

Japanese Patent JP3691374

B2

PROBLEM TO BE SOLVED: To provide a substrate defect inspection method and a substrate defect inspection system that can grasp accurately how a defect occurred in a certain process affects the subsequent processes.
SOLUTION: After a certain process if completed, defects of a wafer W are detected by a defect detecting apparatus 2, and the defect positioning data is transferred to a defect observation apparatus 3. The defects of the wafer W are observed by the defect observation apparatus 3 based on the defect positioning data so as to identify defects, and the identified result is stored in a memory as an initial defect identification data. After the other process is completed, defects of the wafer W are observed so as to identify the defects again by the defect observation apparatus 3 based on the initial defect identification data.

WO/2017/154707	DETECTION DEVICE, DETECTION SYSTEM, DETECTION METHOD, AND DETECTION PROGRAM
JP2013246460	IMAGE PROCESSING APPARATUS, IMAGE PROCESSING METHOD AND PROGRAM
JP2005129065	OBJECT EXTRACTION BASED ON COLOR AND VISUAL TEXTURE

Mizuno Shinsuke

JP2000321063A

September 07, 2005

October 20, 2000

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APPLIED MATERIALS,INCORPORATED

G06T1/00; H01L21/66; G01N21/956; (IPC1-7): H01L21/66; G01N21/956; G06T1/00

JP10038815A
JP2000077496A
JP2000200356A
JP2001148407A
JP2002071575A

Yoshiki Hasegawa
Yuichi Yamada

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