Title:
SUBSTRATE FITTING APPARATUS, SUBSTRATE FITTING METHOD, AND ELECTRONIC APPARATUS
Document Type and Number:
Japanese Patent JP2013110257
Kind Code:
A
Abstract:
To easily and inexpensively attach a multilayer substrate to a housing of an electronic apparatus to provide an electromagnetic bandgap structure.
A multilayer substrate 100 includes: a ground conductor 1 formed on a lower surface of the multilayer substrate 100; a wiring conductor 5; and multiple patch conductors 6 formed at positions on the lower surface of the multilayer substrate 100 at predetermined intervals d1 so as to face the wiring conductor 5. A substrate fitting apparatus 50 includes the multiple patch conductors 6 and multiple conductive leg parts 30 for electrically connecting the patch conductors 6 to a housing 10 of an electronic apparatus 200.
Inventors:
TANAKA HIROSHI
SAITO YOSHIYUKI
IWAKI HIDEKI
NISHIYAMA TOSAKU
SAITO YOSHIYUKI
IWAKI HIDEKI
NISHIYAMA TOSAKU
Application Number:
JP2011253823A
Publication Date:
June 06, 2013
Filing Date:
November 21, 2011
Export Citation:
Assignee:
PANASONIC CORP
International Classes:
H05K9/00; H01P1/22; H05K1/02; H05K7/14
Attorney, Agent or Firm:
Mitsuo Tanaka
Samejima Mutsumi
Kawabata Junichi
Samejima Mutsumi
Kawabata Junichi
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