Title:
基板研削装置及び基板研削方法
Document Type and Number:
Japanese Patent JP7301512
Kind Code:
B2
Abstract:
Provided is a substrate grinding device including: a work table rotatable with the work table sucking and holding a substrate; a cup wheel-type first grinding wheel configured to grind the rotating substrate while rotating, the substrate being held by the work table; and a cup wheel-type second grinding wheel configured to grind the substrate along with grinding by the first grinding wheel while rotating in a close vicinity of the substrate.
Inventors:
Satoru Ide
Takahiko Mitsui
Bando Tsubasa
Kazuhiro Takaoka
Takahiko Mitsui
Bando Tsubasa
Kazuhiro Takaoka
Application Number:
JP2018171475A
Publication Date:
July 03, 2023
Filing Date:
September 13, 2018
Export Citation:
Assignee:
Okamoto Machine Tool Co., Ltd.
International Classes:
B24B7/04; B24B41/06; H01L21/304
Domestic Patent References:
| JP2014097551A | ||||
| JP2007203432A |
Foreign References:
| WO2017138355A1 | ||||
| US5622875 |
Attorney, Agent or Firm:
Masahisa Ohtake