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Title:
SUBSTRATE HOLDER FOR FILM FORMATION BY SPUTTERING
Document Type and Number:
Japanese Patent JPH05230651
Kind Code:
A
Abstract:

PURPOSE: To prevent the cracking of a substrate for film formation by sputtering during film formation by using a thermal insulating material to form the contact part of the substrate holder consisting of the contact part to be imposed with the substrate for film formation by sputtering and a frame part holding the contact part.

CONSTITUTION: The substrate holder for film formation by sputtering is formed by fixing a spacer S made of a fluororesin to be directly imposed with the outer edge part of the glass substrate G to the inner side of a substrate transporting tray T having a square frame shape. The tray T carrying the substrate G is moved in an arrow direction so as to intersect orthogonally with a target R in a vacuum chamber D and the target R is sputtered by a sputtering gas, by which the film is formed on the substrate G. Since the spacer S has a thermal insulating characteristic at this time, the smaller temp. difference between the outer edge part of the substrate G and the film forming surface on the inner side is only necessitated. The cracking of the substrate G is thus prevented.


Inventors:
YAMADA MASAYUKI
SAITO TADAHIKO
Application Number:
JP7216792A
Publication Date:
September 07, 1993
Filing Date:
February 24, 1992
Export Citation:
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Assignee:
NIKON CORP
International Classes:
C23C14/34; C23C14/50; (IPC1-7): C23C14/34; C23C14/50
Attorney, Agent or Firm:
Masatoshi Sato (1 person outside)



 
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