To provide a substrate holder part that is used for a vertical inline sputtering apparatus which causes a target and a substrate to be processed to be opposite to each other in a vertical state, and performs sputtering while conveying the target and the substrate to be processed, and that supports the substrate to be processed by coming in contact therewith and nonetheless when the large-sized substrate to be processed of a G6 generation or more is processed, does not incur damages such as flaws and cracks in the substrate due to the contact, and further does not stick stain and flaws on an invisible level to the surface in contact with a pin in the substrate to be processed.
The substrate holder part is provided with a substrate receiving part face-contacted with the lower side face part of the substrate to be processed and supporting the substrate to be processed. Further, the substrate receiving part is made of a material having high impact absorptivity.
NODA HIROSHI
AZUMI TAKESHI
| JP2007262539A | 2007-10-11 | |||
| JP2003213414A | 2003-07-30 | |||
| JP2003155119A | 2003-05-27 |
Keiko Fukamachi
Hideo Ito
Hiromi Fujimasu
Naoki Goto
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