Title:
SUBSTRATE HOLDING DEVICE, SUBSTRATE HOLDING METHOD, LITHOGRAPHY DEVICE, AND MANUFACTURING METHOD FOR ARTICLE
Document Type and Number:
Japanese Patent JP2023119554
Kind Code:
A
Abstract:
To provide a substrate holding device capable of sucking and holding a substrate in a shape close to a desired shape even if the hardness of the substrate is different.SOLUTION: The substrate holding device includes a sucking unit for sucking a substrate and a control unit for controlling sucking by the sucking unit. The control unit controls sucking of the sucking unit on the basis of hardness information and shape information of the substrate so that sucking of a first substrate that is curved is different from sucking of a second substrate that is softer than the first substrate.SELECTED DRAWING: Figure 4
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Inventors:
KOBAYASHI YOSHINORI
Application Number:
JP2022170050A
Publication Date:
August 28, 2023
Filing Date:
October 24, 2022
Export Citation:
Assignee:
CANON KK
International Classes:
H01L21/683; G03F7/20
Attorney, Agent or Firm:
Takuma Abe
Sougo Kuroiwa
Sougo Kuroiwa
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