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Title:
SUBSTRATE HOLDING DEVICE FOR TREATING SEMICONDUCTOR
Document Type and Number:
Japanese Patent JP3283459
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide a substrate holding device which is free from contamination by impurities, can be maintained easily, and can be manufactured at a low cost.
SOLUTION: A substrate holding device which holds semiconductor substrates in a semiconductor treating device is a separate type susceptor device composed of a mounting block 1 in which a high-frequency electrode 3 is buried and which is made of aluminum nitride and a heating block 2 in which a heating element 7 is buried and which is made of an aluminum alloy. The mounting block 1 is closely adhered to the heating block 2 by engaging the bottom face of the mounting block 1 with the surface of the heating block 2 in a detachable state. The mounting and heating blocks 1 and 2 are elastically engaged with each other in the detachable state by means of a lock mechanism composed at least of one Inconel-made plate spring provided to the bottom face of the block 1 and one opening provided on the surface of the block 2.


Inventors:
Kiyoshi Sato
Mikio Shimizu
Toshihiko Hanmachi
Shinya Miyaji
Application Number:
JP36370997A
Publication Date:
May 20, 2002
Filing Date:
December 17, 1997
Export Citation:
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Assignee:
Japan ASM Co., Ltd.
Nippon Barber Co., Ltd.
International Classes:
C23C16/44; C23C16/458; C23C16/46; H01L21/00; H01L21/205; H01L21/683; H01L21/687; (IPC1-7): H01L21/205; C23C16/46; H01L21/68
Domestic Patent References:
JP936213A
JP98114A
JP9129560A
JP786381A
JP774234A
Attorney, Agent or Firm:
Sumio Takeuchi (1 outside)