To reproduce an abnormal semiconductor substrate where an organic matter adheres to without slicing out due to an inspection process, and to detect the organic matter with improved sensitivity.

In an inspection method, a part other than a central part 13a with a device part on a semiconductor substrate 13, especially a substrate peripheral edge part 13b, is locally heated by a heating laser 14 of a local heating mechanism in a reduced pressure atmosphere which is formed in a vacuum chamber 11, and the local atmosphere changes due to an out gas being generated from the adhered organic matter is analyzed and inspected by a mass spectrometer 17, thus preventing the organic matter at the device part from being heated and modified and easily eliminating the organic matter reproducing the substrate. Also by providing the mass spectrometer 17 where an outgassing suction port 15 near a local heating part, the outgassing with dense concentration can be detected, thus improving the detection sensitivity.