PURPOSE: To provide a substrate for mounting electronic components which consists of thin layers and can accurately position sub-electronic components such as a chip capacitor.

CONSTITUTION: The title substrate consists of a plurality of insulation substrates 9, a recessed part 2 for mounting electronic components, and a sub-electronic components mounting part 70. In the sub-electronic components mounting part 70, a mount hole 1 for mounting a chip capacitor 7 as the sub-electronic components is provided. The depth of the mount hole 1 is larger than the height of the chip capacitor 7. The mount hole 1 is formed on the surface of the insulation substrate 9 on the uppermost layer.