Title:
SUBSTRATE PLACEMENT TABLE, SUBSTRATE PROCESSING DEVICE, AND METHOD FOR MANUFACTURING SUBSTRATE PLACEMENT TABLE
Document Type and Number:
Japanese Patent JP2023131599
Kind Code:
A
Abstract:
To equalize electric fields formed on a surface of a substrate placement table that includes an attraction electrode for attracting a substrate and in which a gas supply hole is formed.SOLUTION: In a substrate placement table that holds a substrate by electrostatic attraction force, a dielectric layer is laminated on an upper side of a base, a top face of thereof serving as a placement table for the substrate, and an attraction electrode that generates the electrostatic attraction force is buried in the dielectric layer. A gas supply port for supplying a gas toward the substrate penetrates the base, the attraction electrode and the dielectric layer and opens in the placement surface, with a through-hole formed in the attraction electrode provided so as to enclose the gas supply port by being isolated via an isolation part. A shield layer composed of a conductor is disposed by being electrically isolated from the attraction electrode, and is formed so as to cover at least a portion of the isolation part in a plan view, and to enclose the gas supply port.SELECTED DRAWING: Figure 3
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Inventors:
FUKAZAWA JUNICHI
HEMMI ATSUSHI
OGAMI KATSUYUKI
YAMASHINA ISAKU
HEMMI ATSUSHI
OGAMI KATSUYUKI
YAMASHINA ISAKU
Application Number:
JP2022036453A
Publication Date:
September 22, 2023
Filing Date:
March 09, 2022
Export Citation:
Assignee:
TOKYO ELECTRON LTD
International Classes:
H01L21/3065; H01L21/683
Attorney, Agent or Firm:
Patent Attorney Corporation Yayoi Patent Office