Title:
基板処理装置及び処理条件調整方法
Document Type and Number:
Japanese Patent JP7154416
Kind Code:
B2
Abstract:
A substrate processing apparatus which processes includes a thermal processor that performs thermal processing on the substrate; an imager that images the substrate; and a controller that executes adjustment processing of adjusting conditions of processing on the substrate. The adjustment processing includes: controlling the imager to image an unexposed adjustment substrate on which a resist film is formed; controlling the thermal processor to perform the thermal processing on the adjustment substrate subjected to uniform exposure processing of exposing each region of a substrate surface with a fixed exposure amount after the pre-exposure imaging; controlling the imager to image the adjustment substrate after the thermal processing; estimating an in-plane temperature distribution of the adjustment substrate in the thermal processing based on the pre-exposure imaging result and the post-heating imaging result; and deciding processing conditions of the thermal processing based on an estimation result of the in-plane temperature distribution.
Inventors:
Tadokoro Shinto
Masashi Enomoto
Kentaro Yamamura
Masashi Enomoto
Kentaro Yamamura
Application Number:
JP2021533945A
Publication Date:
October 17, 2022
Filing Date:
July 10, 2020
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/027; H01L21/683
Domestic Patent References:
| JP2017028086A | ||||
| JP2008141086A |
Foreign References:
| WO2018225615A1 |
Attorney, Agent or Firm:
Kanemoto Tetsuo
Koji Hagiwara
Naoki Ogita
Takashi Saito
Takuya Mine
Koji Hagiwara
Naoki Ogita
Takashi Saito
Takuya Mine
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