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Title:
基板処理装置、及び基板処理装置の配管洗浄方法
Document Type and Number:
Japanese Patent JP7302997
Kind Code:
B2
Abstract:
To provide a substrate processing device capable of suppressing occurrence of a malfunction in a substrate even in a case where a pipe is cleaned using a chemical solution which is not used for processing the substrate.SOLUTION: A substrate processing device 1 comprises a processing chamber 2, a substrate holding part 3, a shield part 6, a movement mechanism 8, a nozzle 61, process liquid lines 301 and 302, a cleaning fluid supply line 114 and a control section 12. The movement mechanism 8 moves the substrate holding part 3 and the shield part 6 relatively between a position to form a closed space 100 and a position to open the closed space 100. The control section 12 controls the movement mechanism 8 so as to form the closed space 100 when cleaning pipes of the process liquid lines 301 and 302 using a pipe cleaning fluid. The control section 12 controls a valve of the cleaning fluid supply line 114 in such a manner that the pipe cleaning fluid is supplied to the pipes of the process liquid lines 301 and 302. The control section 12 also controls valves of the process liquid lines 301 and 302 in such a manner that the pipe cleaning fluid is discharged from the nozzle 61 into the closed space 100.SELECTED DRAWING: Figure 2

Inventors:
Io Okamoto
Hiromasa Yabe
Takahide Suda
Application Number:
JP2019053838A
Publication Date:
July 04, 2023
Filing Date:
March 20, 2019
Export Citation:
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Assignee:
Screen Holdings Co., Ltd.
Mitsui Chemours Fluoro Products Co., Ltd.
International Classes:
H01L21/304; B08B9/032
Domestic Patent References:
JP2019012791A
JP2001191043A
JP2015220318A
JP2012071217A
JP7171735A
JP11033302A
JP2016113485A
JP2006222466A
JP2015040279A
JP2018056550A
JP2004321880A
JP2007335815A
JP2010114414A
JP2010056208A
Foreign References:
WO2014013902A1
Attorney, Agent or Firm:
Hiroyuki Maei



 
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