基板処理装置、半導体装置の製造方法およびプログラム

Title:

基板処理装置、半導体装置の製造方法およびプログラム

Document Type and Number:

Japanese Patent JP7186236

Kind Code:

B2

Abstract:

Provided is a configuration which: includes a control unit which causes a substrate processing system to execute a process recipe including a plurality of steps; and during the execution of the process recipe, for a step satisfying a predetermined collection condition, collects component data on a component to be monitored in the substrate processing system, generates a correlation curve indicating a correlation between the collected component data, compares the generated correlation curve with an initial correlation curve as a reference stored in advance to determine whether or not a difference between the correlation curve and the initial correlation curve exceeds a predetermined threshold value, and generates an alarm, when the difference exceeds the threshold value.

Inventors:

Kaga Yuki Nao
Ichiyoshi Yamamoto
Hayashibara Hidemoto
Kazuhide Asai

Application Number:

JP2020547492A

Publication Date:

December 08, 2022

Filing Date:

September 18, 2018

Export Citation:

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