SUBSTRATE PROCESSING DEVICE

Title:

SUBSTRATE PROCESSING DEVICE

Document Type and Number:

Japanese Patent JP2000199084

Kind Code:

A

Abstract:

To provide a substrate processing device which is capable of uniformly processing a substrate even when there is a difference in temperature between the substrate and a chemical.

A substrate processing device 10 is provided with a rotary chuck 14 to maintain a substrate 12 of a liquid crystal display, and a chemical discharge nozzle 16 to discharge a chemical hotter than the substrate 12 to the substrate 12. A discharge outlet 26 of the chemical discharge nozzle 16 is set to discharge more chemical to a peripheral part than to a center part of the substrate 12. Uniform processing is possible by promoting the reaction of the chemical for the peripheral part of the substrate 12 in which the etching is easily insufficient to the center due to the temperature drop.

More Like This:

JP2022128131	PAINT FOR DISPENSING PAINTING, AND PRODUCTION METHOD OF PAINTED ARTICLE
WO/2018/141547	APPARATUSES AND METHODS FOR PRODUCING OPTICAL EFFECT LAYERS
WO/2020/263704	ELECTROCHEMICAL ATTACHMENT OF PHOSPHONIC ACIDS TO METALLIC SUBSTRATES AND ANTIMICROBIAL MEDICAL DEVICES CONTAINING SAME

Inventors:

GOTO JUICHI
YAMABE SUMISHIGE

Application Number:

JP28456399A

Publication Date:

July 18, 2000

Filing Date:

October 05, 1999

Export Citation:

Click for automatic bibliography generation Help

Assignee:

TOSHIBA CORP

International Classes:

B05D3/00; B05C9/14; B05C11/08; C23F1/08; G02F1/13; H01L21/306; (IPC1-7): C23F1/08; B05C9/14; B05C11/08; B05D3/00; G02F1/13; H01L21/306

Attorney, Agent or Firm:

Kabazawa Xiang (2 people outside)

Previous Patent: DEVICE AND METHOD FOR ETCHING TIN OXIDE FILM

Next Patent: TREATMENT OF ETCHING WASTE SOLUTION