Title:
基板処理装置及び処理液帯電モニタリング方法
Document Type and Number:
Japanese Patent JP7425172
Kind Code:
B2
Abstract:
Provided is an apparatus for treating a substrate. The substrate treating apparatus may include: a substrate support unit supporting a substrate; a nozzle supplying a liquid to the substrate supported on the substrate support unit; a home port in which the nozzle waits; and an electrostatic measurement member measuring an electrostatic amount of a liquid dispensed from the nozzle in the home port.
Inventors:
Kim, Do Young
Sung, Yang Jun
Li, Tae Hung
Lee, Sang-gyu
Yoon, Hyun
Sung, Yang Jun
Li, Tae Hung
Lee, Sang-gyu
Yoon, Hyun
Application Number:
JP2022205549A
Publication Date:
January 30, 2024
Filing Date:
December 22, 2022
Export Citation:
Assignee:
Cemes Company, Limited
International Classes:
H01L21/027; B05C11/00; B05C11/10; H01L21/304
Domestic Patent References:
| JP2017069552A | ||||
| JP8145947A |
Foreign References:
| US20180334318 |
Attorney, Agent or Firm:
Ryoichi Takaoka
Nao Oda
Akiyo Iwahori
Rena Miyoshi
Kamoto Takahashi
Nao Oda
Akiyo Iwahori
Rena Miyoshi
Kamoto Takahashi
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