Title:
基板処理装置および基板処理方法
Document Type and Number:
Japanese Patent JP5926086
Kind Code:
B2
Abstract:
In a substrate processing apparatus, with an internal space of a chamber brought into a pressurized atmosphere, an etching process is performed by continuously supplying a first processing liquid onto an upper surface of a substrate while rotating the substrate. It is thereby possible to suppress vaporization of the first processing liquid on the substrate and further suppress a decrease in the temperature of the substrate due to the heat of vaporization as it goes from a center portion of the substrate toward a peripheral portion thereof as compared with under normal pressure. As a result, it is possible to improve the uniformity in the temperature of the upper surface of the substrate during the etching process using the first processing liquid and improve the uniformity of etching over the entire upper surface of the substrate.
Inventors:
Hiroshi Masuhara
Kenichiro Arai
Masahiro Miyagi
Toru Endo
Kenichiro Arai
Masahiro Miyagi
Toru Endo
Application Number:
JP2012073600A
Publication Date:
May 25, 2016
Filing Date:
March 28, 2012
Export Citation:
Assignee:
Screen Holdings Co., Ltd.
International Classes:
H01L21/306; H01L21/304
Domestic Patent References:
| JP63211725A | ||||
| JP5074754A | ||||
| JP63014434A | ||||
| JP2008066400A |
Attorney, Agent or Firm:
Masahiro Matsusaka
Tsutomu Tanaka
Masamichi Ida
Tsutomu Tanaka
Masamichi Ida