Title:
基板処理装置、基板処理システムおよび基板処理方法
Document Type and Number:
Japanese Patent JP7453757
Kind Code:
B2
Abstract:
To provide a technique that can appropriately hold a board one by one to perform processing on the board even when a plurality of boards with different warpage states is sequentially transferred.SOLUTION: A board processing apparatus 1 includes a board holding part 2, a chuck drive mechanism 25, and a processing liquid supply part 4. The board holding part 2 has a plurality of first chuck pins 231a that holds a circumference of a first-type board, and a plurality of second chuck pins 231b that holds a circumference of a second-type board. The second-type board is a warpage board more warped than a first-type board. Each of the first chuck pins 231a has a first v-shaped contact surface that sandwiches the circumference of the board in a vertical direction. Each of second shuck pins 231b has a second v-shaped contact surface that sandwiches the circumference of the board in the vertical direction. An upper edge of the second contract surface is higher than an upper edge of the first contact surface, and an upper edge of the second chuck pin 231b is higher than an upper edge of the first chunk pin 231a.SELECTED DRAWING: Figure 5
Inventors:
Hitoshi Nakai
Ryo Muramoto
Ryo Muramoto
Application Number:
JP2019138092A
Publication Date:
March 21, 2024
Filing Date:
July 26, 2019
Export Citation:
Assignee:
Screen Holdings Co., Ltd.
International Classes:
H01L21/683; H01L21/304
Domestic Patent References:
| JP2018164036A | ||||
| JP2004055641A | ||||
| JP2012212751A | ||||
| JP2008177454A |
Attorney, Agent or Firm:
Hidetoshi Yoshitake
Takahiro Arita
Takahiro Arita