Title:
基板処理システム及び基板処理方法
Document Type and Number:
Japanese Patent JP7134893
Kind Code:
B2
Abstract:
To provide a substrate processing system and a substrate processing method capable of avoiding a production stop of processed substrates in the entire production line even when a main power supply to a specific processing machine is stopped in a production line where multiple processors are arranged.SOLUTION: Each of a plurality of mounters 3 includes a branch path unit 8 that constructs a branch power supply cable 81 and a first branch communication cable 82. The branch power supply cable 81 is a power supply path branched from a transfer power supply path 71 from a main power supply circuit unit 41 to a substrate transfer mechanism 35. The first branch communication cable 82 is a communication path branched from a transfer communication path 72 from a main control circuit unit 42 to the substrate transfer mechanism 35. The branch power supply cable 81 and the first branch communication cable 82 enable supply of power and control signals from the main power supply circuit unit 41 and the main control circuit unit 42 of the mounter 3A other than a specific mounting machine 3B to the substrate transfer mechanism 35 of the specific mounter 3B.SELECTED DRAWING: Figure 3
Inventors:
Masataka Arai
Application Number:
JP2019016934A
Publication Date:
September 12, 2022
Filing Date:
February 01, 2019
Export Citation:
Assignee:
YAMAHA HATSUDOKI KABUSHIKI KAISHA
International Classes:
H05K13/04; G05B19/418; H05K13/00
Domestic Patent References:
| JP2016058671A | ||||
| JP2003133789A | ||||
| JP2015076536A |
Foreign References:
| WO2017130341A1 | ||||
| WO2018131066A1 |
Attorney, Agent or Firm:
Etsushi Kotani
Masataka Kotani
Haruhiro Hirata
Masataka Kotani
Haruhiro Hirata