Title:
SUBSTRATE SUPPORT DEVICE
Document Type and Number:
Japanese Patent JP2007311814
Kind Code:
A
Abstract:
To prevent sticking of a substrate due to heat treatment and to make the temperature distribution of the substrate uniform at the time of heating, in a substrate support device which is configured to hold the substrate, such as a wafer, horizontally in a treatment chamber of a substrate treating device.
The substrate support device comprises a support device main body in which a surface is formed to be approximately even, and floating pins attached to the surface of the support device main body. The floating pins are arranged in at least three spots which are not aligned with one another so as to project from the surface of the support device main body.
COPYRIGHT: (C)2008,JPO&INPIT
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Inventors:
SUZUKI MASAYUKI
Application Number:
JP2007168842A
Publication Date:
November 29, 2007
Filing Date:
June 27, 2007
Export Citation:
Assignee:
HITACHI INT ELECTRIC INC
International Classes:
H01L21/683; H01L21/3065; C23C16/50
Domestic Patent References:
| JPH0547652A | 1993-02-26 |
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