Title:
SUBSTRATE-TREATING DEVICE
Document Type and Number:
Japanese Patent JP3717399
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a treatment device for performing treatment by a treatment nozzle when controlling the atmosphere of the treatment space of a substrate.
SOLUTION: The substrate-treating device 2 retains the substrate W on a rotary support plate 21, and performs rotary treatment at treatment space S that is formed by pinching the substrate W at an area to an upper rotary plate 41. An ultrasonic cleaning mechanism 200 comprises a contact/separation mechanism 201, a support arm 202, and ultrasonic cleaning nozzles 203 and 203 at the tip. After a screening plate 451 retreats from an opening 41a of the upper rotary plate 41, the ultrasonic cleaning nozzles 203 and 203 enter for performing the ultrasonic cleaning of the surface of the substrate W.
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Inventors:
Hiroyuki Kitazawa
Application Number:
JP2000381261A
Publication Date:
November 16, 2005
Filing Date:
December 15, 2000
Export Citation:
Assignee:
Dainippon Screen Mfg. Co., Ltd.
International Classes:
G02F1/1333; B05C5/02; B05C11/10; B08B3/02; H01L21/304; (IPC1-7): H01L21/304; B05C5/02; B05C11/10; B08B3/02; G02F1/1333
Domestic Patent References:
| JP2000077378A |
Attorney, Agent or Firm:
Ryose Uji
Kakusho Shoichi
Kakusho Shoichi
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