To provide a substrate treatment apparatus and substrate treatment method, which sufficiently remove residues attaching to the front and rear faces of a substrate after ashing.

The substrate is carried in into an ashing section by a substrate transfer robot, and ashing is conducted on the substrate inside the ashing section. Then, a cooling treatment is performed on the substrate inside a cooling plate. Thereafter, the substrate is inverted inside a substrate inversion section, wherein the front and rear faces of the substrate are inverted. Then, the rear face of the substrate is wash-treated inside a wash-treatment section, and the wash-treated substrate is dried inside the wash-treatment section. Thereafter, the substrate is carried out of the wash-treatment section by the substrate transfer robot.