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Title:
SUBSTRATE TREATMENT APPARATUS
Document Type and Number:
Japanese Patent JP2012049324
Kind Code:
A
Abstract:

To prevent an adverse effect on the control of an amount of evaporation in a carburetor caused by air bubbles generated due to a dissolved gas in a liquid law material.

A substrate treatment apparatus comprises: a liquid raw material supply source for force-feeding the liquid raw material by using an inert gas; a liquid raw material supply pipe which becomes a channel of the liquid raw material that is force-fed from the liquid raw material supply source; the carburetor which evaporates the liquid raw material that is supplied from the liquid raw material supply source through the liquid raw material supply pipe to produce an evaporated gas; and a treatment chamber to which the evaporated gas produced in the carburetor is supplied. The substrate treatment apparatus further comprises a liquid raw material storage section which is provided in a middle part of a path in the liquid raw material supply pipe and stores the liquid raw material flowing in the liquid raw material supply pipe therein, and removes the air bubbles in the liquid raw material storage section, which are generated in the liquid raw material due to the pressure drop in the liquid raw material supply pipe.


Inventors:
YOSHIDA HISASHI
Application Number:
JP2010189806A
Publication Date:
March 08, 2012
Filing Date:
August 26, 2010
Export Citation:
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Assignee:
HITACHI INT ELECTRIC INC
International Classes:
H01L21/205; C23C16/448; H01L21/31; H01L21/316; H01L21/318
Attorney, Agent or Firm:
Toru Yui
Aniya Setsuo
Hitoshi Kiyono
Fukuoka Masahiro