Title:
半導体ウェーハ用吸着パッド
Document Type and Number:
Japanese Patent JP4675213
Kind Code:
B2
Inventors:
Satoshi Odashima
Kiyofumi Tanaka
Noriyoshi Hosono
Kiyofumi Tanaka
Noriyoshi Hosono
Application Number:
JP2005318476A
Publication Date:
April 20, 2011
Filing Date:
November 01, 2005
Export Citation:
Assignee:
Shin-Etsu Polymer Co., Ltd.
International Classes:
H01L21/677; B25J15/06; H01L21/683
Domestic Patent References:
| JP1262638A | ||||
| JP2003100848A | ||||
| JP2003081379A | ||||
| JP2068897A |
Attorney, Agent or Firm:
Eisuke Fujimoto
Masayoshi Kanda
Akio Miyao
Masayoshi Kanda
Akio Miyao