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Patent Searching and Data


Title:
SUCTION TRANSFERRING DIE
Document Type and Number:
Japanese Patent JPH07148535
Kind Code:
A
Abstract:

PURPOSE: To effectively make index up at the time of sucking and transferring a piece chip by installing a guide mechanism which sucks the piece chip on a die side and progressively transfers it.

CONSTITUTION: A piece chip 120 as an article to be machined is machined progressively through each machining stage from an advancing edge side, the piece chip 120 on each machining state 110 is once sucked supported with a suction pad then transferred to the next machining stage 110. A feeding arm 112 has slide parts for guiding so as to reciprocate the piece chip 120 parallel to the transferring direction on the both sides in the lateral direction of the machining stage 110. Then, a supporting plate is bridged between opposite slide parts, and a downward facing suction pad 114 is attached on the down surface of the supporting plate. Each suction pad 114 supports with sucking the piece chip with the negative pressure by being connected to a negative pressure sucking mechanism of a vacuum generating mechanism, etc. The slide parts of the feeding arm 112 are supported with guiding with slide guides 116 installed on the field plates 111a, 111b.


Inventors:
SOYAMA HIDEKI
Application Number:
JP29990393A
Publication Date:
June 13, 1995
Filing Date:
November 30, 1993
Export Citation:
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Assignee:
APIC YAMADA KK
International Classes:
B21D43/05; B21D43/18; B21D53/00; H01L21/00; H01L21/677; B21D28/00; H01L23/50; H05K13/00; (IPC1-7): B21D43/05; B21D28/00; B21D43/18; B21D53/00; H01L23/50
Attorney, Agent or Firm:
Takao Watanuki (1 outside)