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Title:
SUPER-ABRASIVE GRAIN WIRE SAW AND MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2002036091
Kind Code:
A
Abstract:

To provide a super-abrasive grain wire saw capable of preventing peeling of a binding material caused by falling of a super-abrasive grain, effectively conducting slicing processing at high accuracy and having a long service life for a fixed abrasive grain type super-abrasive grain wire saw.

In this super-abrasive grain wire saw P, the super-abrasive grain D is fixed on a surface of a core wire W with the binding material R. A ratio of a projected area of the super-abrasive grain D to a surface area of the core wife W is 5% or more and 55% or less. By changing a mixture ratio of the super-abrasive grain D and the binding material R, the ratio of the projected area of the super-abrasive grain D to the surface area of the core wire W is controlled to 5% or more and 55% or less.


Inventors:
YAMANAKA MASAAKI
OGAWA HIDEKI
NAKAI MASANORI
URAKAWA NOBUO
Application Number:
JP2001143636A
Publication Date:
February 05, 2002
Filing Date:
May 14, 2001
Export Citation:
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Assignee:
ALLIED MATERIAL CORP
International Classes:
B24B27/06; B24D3/00; B24D3/02; B24D11/00; (IPC1-7): B24B27/06; B24D3/00; B24D3/02; B24D11/00
Attorney, Agent or Firm:
Fukami Hisaro (3 outside)