PURPOSE: To obtain a super microconnector (SMC), and a manufacturing method thereof, in which a good electrical connection can be made between a semiconductor chip and a wiring board.
CONSTITUTION: In an SMC where a plurality of conductors 2, each provided with solder bumps 6 at the opposite ends thereof, are arranged in parallel and held integrally by means of a holding material 3, the holding material 3 is made of a material dissolving or decaying at a temperature lower than the melting point of the solder bump 6. Since the material holding the SMC dissolves or decays prior to fusion of the solder bump, positional shift due to difference in the coefficient of thermal expansion between a planar composite body and a semiconductor chip or a wiring board does not take place between the solder bump and the pad thus realizing a good electrical connection between the semiconductor chip and the wiring board.
CHIGUSA SHIGEFUMI
FURUSAWA KEISUKE
ISHII NORIO
| JPH02241045A | 1990-09-25 | |||
| JP63147817B |