Title:
SUPPLYING DEVICE FOR SLURRY
Document Type and Number:
Japanese Patent JP3179064
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To mix slurry well and to freely manage a mixing ratio of the slurry.
SOLUTION: The supplying device for slurry for supplying to a CMP polishing device is provided with an abrasive grain liquid supplying system supplied from an abrasive grain liquid tank 10 and an addition solution supplying system supplied from an addition solution tank 11. The abrasive grain liquid and the addition solution from both supplying systems are combined and they are poured into a mixer 14 and sufficiently mixed to obtain a slurry immediately before they are supplied to an abrasive surface plate 22 and thereafter, the slurry is supplied to the abrasive surface plate 22.
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Inventors:
Minoru Numamoto
Application Number:
JP873499A
Publication Date:
June 25, 2001
Filing Date:
January 18, 1999
Export Citation:
Assignee:
Tokyo Seimitsu Co., Ltd.
International Classes:
B24B57/02; B24B37/00; B24B37/015; H01L21/304; (IPC1-7): B24B57/02; B24B37/00; H01L21/304
Domestic Patent References:
| JP63306881A | ||||
| JP10146751A | ||||
| JP8118232A | ||||
| JP680533U |
Attorney, Agent or Firm:
Takashi Ishida (4 others)