Title:
SUPPORT SUBSTRATE, SUBSTRATE LAMINATE, LAMINATING DEVICE, PEELING DEVICE, AND MANUFACTURING METHOD OF SUBSTRATE
Document Type and Number:
Japanese Patent JP2012079871
Kind Code:
A
Abstract:
To provide a substrate which can reduce occurrence of damage, and to provide a substrate laminate, a laminating device, and a manufacturing method of a substrate.
The support substrate is laminated on a substrate with a bonding portion interposed therebetween. The support substrate has a base portion, and a transmission portion provided on the peripheral end face of the base portion. Refractive index of the transmission portion for laser light is different from that of the base portion for laser light.
Inventors:
KOYAMA HIROTAKA
ABE MASAYASU
ABE MASAYASU
Application Number:
JP2010222816A
Publication Date:
April 19, 2012
Filing Date:
September 30, 2010
Export Citation:
Assignee:
SHIBAURA MECHATRONICS CORP
International Classes:
H01L21/683; H01L21/304
Domestic Patent References:
| JP2004064040A | 2004-02-26 | |||
| JP2006196705A | 2006-07-27 | |||
| JP2010098072A | 2010-04-30 | |||
| JPH08162429A | 1996-06-21 | |||
| JP2005136098A | 2005-05-26 | |||
| JP2003197570A | 2003-07-11 | |||
| JP2002333618A | 2002-11-22 | |||
| JP2003332279A | 2003-11-21 |
Attorney, Agent or Firm:
Masahiko Hinataji
Junichi Kozaki
Hiroshi Ichikawa
Soichi Homma
Yukinobu Hibino
Tatsutetsu Shirai
Junichi Kozaki
Hiroshi Ichikawa
Soichi Homma
Yukinobu Hibino
Tatsutetsu Shirai
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