Title:
平面研削砥石
Document Type and Number:
Japanese Patent JP6925699
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a flat surface grinding abrasive wheel that can readily discharge grinding chips to the outside and supply a processing point with a sufficient amount of grinding water.SOLUTION: A flat surface grinding abrasive wheel 14 includes: an annular base 16 attached to a spindle; and an abrasive wheel part 18 to which an abrasive grain 24 is fixed by a plated layer 22 for coating an outer peripheral surface 16b of the annular base 16. A helical groove 18b continuing along a circumferential direction of the base 16 is provided at the outer peripheral surface 16b of the abrasive wheel part 18. The groove 18b has a width and a depth that is 1.5 to 3 times larger than a particle diameter of the abrasive grain 24.SELECTED DRAWING: Figure 2
More Like This:
| JP2001500434 | [Title of Invention] Grinding wheel |
| JP2001047368 | MANUFACTURE OF SUPER-ABRASIVE GRAIN WHEEL |
Inventors:
Yoshino Okino
Application Number:
JP2016196286A
Publication Date:
August 25, 2021
Filing Date:
October 04, 2016
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
B24D5/00; B24D3/06; H01L21/301
Domestic Patent References:
| JP2010115771A | ||||
| JP10113878A | ||||
| JP2009045723A |
Foreign References:
| WO2015112540A1 |
Attorney, Agent or Firm:
Akira Matsumoto
Tomohiro Okamoto
Kasahara Takahiro
Tomohiro Okamoto
Kasahara Takahiro