Title:
表面実装型高周波モジュール
Document Type and Number:
Japanese Patent JP3983711
Kind Code:
B2
Abstract:
A surface-mount-type high-frequency module in accordance with one or more embodiments of the present invention comprises BGA package IC(s) 1 and printed circuit board(s) carrying such BGA package IC(s) 1; such printed circuit board(s) being multilayer board(s), laminated at which there are inner layer(s) comprising core material(s) 6, and outer layer(s) constituting exterior(s) relative to inner layer(s) and comprising build-up layer(s) 5. Top surface(s) of printed circuit board(s) (core material(s) 6), in region(s) where BGA package IC(s) 1 carried thereby is/are mounted, is/are formed so as to be lower than top surface(s) of outer layer(s) (build-up layer(s) 5). Gap(s) between core material(s) 6 and BGA package IC(s) 1 is/are filled with encapsulant resin(s) 3.
Inventors:
Yu Kosaka
Application Number:
JP2003118773A
Publication Date:
September 26, 2007
Filing Date:
April 23, 2003
Export Citation:
Assignee:
Sharp Corporation
International Classes:
H01L23/12; H01L25/18; H01L25/04; H05K1/18; H05K9/00; H05K1/02; H05K3/28; H05K3/40
Domestic Patent References:
| JP2001267486A | ||||
| JP2001060641A | ||||
| JP2003031724A | ||||
| JP8213516A | ||||
| JP10116856A | ||||
| JP2000302841A |
Attorney, Agent or Firm:
Yoshiro Kurauchi