PURPOSE: To provide a surface mounting type multilayer printed substrate in which suction of melted solder of foot print into a viahole at the time of mounting in the multilayer printed substrate.

CONSTITUTION: In a multilayer printed substrate 1 having an inner layer conductor 11 and a foot print 4 for soldering a surface mounting type electronic component, a depth of a viahole 2A connected to the print 4 and having a conductor layer 12 on its inner wall is that connected to the conductor 11 provided on the substrate 1 without penetrating the substrate 1.