To obtain a surface polishing device which improves working accuracy by preventing a workpiece and a polishing pad from repeatedly contacting with each other in the same patterns or following the same working trace and also suppresses crashes or scratches of a carrier due to vibration or flopping of the carrier.
A pad sticking surface 8 and a polishing pad 12 of a lower surface plate 2 among upper and lower surface plates 1 and 2 are formed to be concentric with a rotation center O1 of the lower surface plate 2. In addition, a pad sticking surface 7 and a polishing pad 11 of the upper surface plate 1 are formed to occupy a position eccentric from the rotation center O1 of the upper surface plate 1 and to have a smaller outer diameter and a larger inner diameter than those of the pad sticking surface 7 and the polishing pad 12 of the lower surface plate 2. Further, the workpiece W is made to overhang at both inner and outer peripheral sides of the polishing pad 11 of the upper surface plate 1 among the upper and lower plates 1 and 2.
SHIMIZU TOSHIKUNI
| JP2001138225A | 2001-05-22 | |||
| JPH11262855A | 1999-09-28 | |||
| JPH11309669A | 1999-11-09 | |||
| JP2002025951A | 2002-01-25 | |||
| JP2004087521A | 2004-03-18 | |||
| JP2004146704A | 2004-05-20 |
Masahiko Goto
Hayashi Naoki