SURFACE PROFILE MEASURING APPARATUS AND SEMICONDUCTOR WAFER INSPECTION APPARATUS

Japanese Patent JP2011226989

A

To provide a surface profile measuring apparatus and a semiconductor wafer inspection apparatus that can measure the surface profile of semiconductor wafers with precision suitable for the surface profile measurement and in a shorter time.

A surface profile measuring apparatus Sa according to the present invention includes a light source 1 for illuminating a surface of a semiconductor wafer SW, which is to be measured, with measurement light having a predetermined wavefront, a wavefront sensor 4 that measures the wavefront shape of reflected light of the measurement light reflected from the surface of the semiconductor wafer SW, and a calculation controller 7a that determines the surface profile of the semiconductor wafer SW based upon the wavefront shape of the reflected light measured by the wavefront sensor 4. A semiconductor wafer inspection apparatus comprises such a surface profile measuring apparatus Sa.

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AMANAKA MASAHITO
KAJITA MASAKAZU
TAKAHASHI EIJI
MORIMOTO TSUTOMU

JP2010098916A

November 10, 2011

April 22, 2010

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KOBE STEEL LTD

G01B11/24; H01L21/66

JP2001241923A	2001-09-07
JP2010121960A	2010-06-03
JP2003503726A	2003-01-28
JP2009236706A	2009-10-15
JP2007281126A	2007-10-25
JP2010021485A	2010-01-28
JP2001241923A	2001-09-07
JP2010121960A	2010-06-03

Etsushi Kotani
Masataka Otani
Satoshi Sakurai

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