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Title:
SYNTHETIC RESIN MOLDING, SYNTHETIC RESIN MOLDING ASSEMBLY, AND METHOD OF MANUFACTURING SYNTHETIC RESIN MOLDING
Document Type and Number:
Japanese Patent JP2001116024
Kind Code:
A
Abstract:

To provide a synthetic resin molding which is joined by a recess portion and a projecting portion and does not easily break away after joining, a synthetic resin mold assembly, and a method of manufacturing a synthetic resin molding.

The diameter of a projecting portion 18 forming a joint portion of foamable synthetic resin is constituted to expand toward a tip end, and the inner diameter of a recess portion in which the projecting portion is inserted to fit with is constituted to expand toward a bottom portion. The foamable synthetic resin, when molded, is unmolded in a state of being still soft, in the mold, so that the resin is elastically deformed to extract a part corresponding to a shape of the recess portion and the projecting portion from the resin and then hardened.


Inventors:
ISHIDA AKIRA
Application Number:
JP29601499A
Publication Date:
April 27, 2001
Filing Date:
October 18, 1999
Export Citation:
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Assignee:
WAKO KK
International Classes:
B29C33/42; B29C44/00; B29C65/56; F16B5/07; (IPC1-7): F16B5/07; B29C33/42; B29C65/56; B29C44/00
Attorney, Agent or Firm:
Nihei Masataka