Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
SYSTEM FOR ANALYZING DEVICE TO BE TESTED AND METHOD FOR TESTING DEVICE TO BE TESTED
Document Type and Number:
Japanese Patent JP2012093355
Kind Code:
A
Abstract:

To provide an apparatus and a method for analyzing a heat image for defects such as a void in a via like TSV.

A controlled amount of heat is injected into a stacked die using a light beam, the transmitted heat is measured using a LIT camera from the opposite side of the die. The obtained heat image is obtained to have properties so that the heat image may be used to calibrate phase shift from a given stack layer, or that the heat image may be used to specify a defect within a stacked die. This process may be repeated for each die in a stack to generate reference for future testing.


Inventors:
DESLANDES HERVE
RUDLOFF SCHLANGEN
PRASAD SABBINENI
REVERDY ANTOINE
Application Number:
JP2011233006A
Publication Date:
May 17, 2012
Filing Date:
October 24, 2011
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
DCG SYSTEMS INC
International Classes:
G01R31/26; H01L21/66
Domestic Patent References:
JP2008016778A2008-01-24
JPH09505886A1997-06-10
JPH0792237A1995-04-07
JPS6352048A1988-03-05
JP2005283497A2005-10-13
Foreign References:
US7018094B12006-03-28
Attorney, Agent or Firm:
Hiroshi Maeda
Hiroshi Takeuchi
Takahisa Shimada
Yuji Takeuchi
Katsumi Imae
Kazunari Ninomiya
Tomoo Harada
Seki Kei
Yasuya Sugiura
Daisuke Kawabe
Masanori Hasegawa
Tsuguya Iwashita
Koji Fukumoto
Ryo Maeda
Mawaki Hachizo
Yukichi Matsunaga
Kenji Kawakita
Shohei Okazawa



 
Previous Patent: DIAGNOSIS OF BEARING THERMAL ANOMALIES IN ELECTRICAL MACHINE

Next Patent: DIAGNOSIS OF STATOR THERMAL ANOMALIES IN ELECTRICAL MACHINE