To provide a technique for effectively testing and transporting IC chips with a carrier tape.
A cassette 20 for transporting and testing semiconductor IC chips 14 comprises a tape supply reel 20.1 and a tape take up reel 20.2, an apertured carrier tape 12 wound on the reels, the tape having sprocket holes and chip sites at which the chips are pre-loaded topside up, the tape allowing access to both the topside and backside of the chips, a test station window 20.3 located in a surface of the cassette so as to provide access to the topside of a chip in registration with the window, a first cavity 20.5 for receiving an indexing mechanism for moving the tape and for bringing chips sites into registration with the test station window and a second cavity 20.6 for receiving an ejector mechanism for pushing on the backside of a semiconductor chip.
SEITZER PHILIP WILLIAM
VASUDEVAN KEELATHUR N
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