Title:
THz BAND INSPECTION DEVICE AND INSPECTION METHOD USING THz BANDS
Document Type and Number:
Japanese Patent JP2015087270
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To configure a small-sized THz band inspection device at low cost.SOLUTION: Electromagnetic waves of THz bands are generated by a THz wave generator 21, converged and outputted to a beam scanning mirror part 30 as a beam. In the beam scanning mirror part 30, the beam outputted from the THz wave generator 21 is received by a rotary polygon mirror 31 as a reflector and a beam scanning the inside of a predetermined inspection target area E is outputted. Transmission waves or reflection waves of the beams of THz bands having scanned the inspection target area E are received by sensor surfaces of a plurality of sensor elements 40a, and an intensity for each scanning position is detected. On the basis of output of the plurality of sensor elements 40a, an object W to be measured within the inspection target area E is analyzed by a signal processing part 50, and a result of the analysis is outputted and displayed on a display part 60.
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Inventors:
OTANI AKIHITO
Application Number:
JP2013226280A
Publication Date:
May 07, 2015
Filing Date:
October 31, 2013
Export Citation:
Assignee:
ANRITSU CORP
International Classes:
G01N21/3581
Domestic Patent References:
| JP2011117957A | 2011-06-16 | |||
| JP2009049147A | 2009-03-05 | |||
| JP2007218661A | 2007-08-30 | |||
| JPH03285145A | 1991-12-16 | |||
| JP2008241438A | 2008-10-09 | |||
| JPH02290534A | 1990-11-30 |
Foreign References:
| US4785185A | 1988-11-15 |
Attorney, Agent or Firm:
Seishi Hayakawa