PURPOSE: To prevent application of a signal to a defective element in a preburn-in test by coping with a deformation of a TAB tape and applying a signal to individual semiconductor elements on the tape.

CONSTITUTION: A burn-in signal applying device is formed in so-called 'a clothespin state', inserted into sprocket holes 5 of a TAB tape 8 by a positioning mechanism 2, and a signal voltage from the burn-in device is supplied to a test terminal 6 of a semiconductor element. Thus, even if the tape 8 is deformed by heat, it can be coped with by inserting it into the holes 5. Since it has a signal cable 3 having the degree of freedoms, burn-in operation can be executed without separating the tape 8 at each tape, and application of the signal to a defective element in a preburn-in test can be prevented.