To provide a TAB tape carrier for a semiconductor device, which can suppress or eliminate the occurrence of a joint failure to a semiconductor device and a short circuiting failure between bumps, and can respond to fine pitch formation; and to provide a method of manufacturing the same.

The TAB tape carrier for a semiconductor device includes: an insulating substrate 1; wires 2 formed on the insulating substrate 1 to constitute a predetermined wiring circuit system by being electrically connected to a semiconductor device (not shown in fig.) mounted on the insulating substrate 1; and bumps 5 continued to the wires 2 and set to be physically connected to electrical joint parts of the semiconductor device. The bumps 5 are formed of the same conductor material continued to the wires 2, and formed thicker than the thickness of the wires 2. The wire width of the wire 2 is set smaller than the bump width, of the bump 5 connected to the wire 2, in the same direction as the wire width direction of the wire 2.