PURPOSE: To bond the chip, to be provided on a carrier film, and the inner lead of the conductor circuit formed on the carrier film without giving damage to the chip, to form a lead pattern in proper shape even when it has multipin structure, and to obtain a TAB tape of excellent mountability.
CONSTITUTION: The chip part of the inner lead of the conductor circuit, formed by etching the metal film 5 which is adhered to the carrier film 1 having a device hole, a sproket hole and an outer lead hole, is protruding to the device hole. In the TAB tape on which a chip 12, which is provided separately from an inner lead, is bonded, the tip part of the inner lead is coated with A 16, and also, if necessary, tin, lead, zinc, gold, silver or their alloy is coated on the outer lead 9 of the conductor circuit in the TAB tape.
ARAKI TSUTOMU
KOBAYASHI KATSUICHIRO
