PURPOSE: To enhance a pattern interconnection density on a printed wiring board by a method wherein a two or more arbitrary fingers are connected inside a device hole by using the same material as the fingers.

CONSTITUTION: An IC chip 3 is mounted on a TAB tape 1; after that, the tape is cut along a cutting line 12; outer leads 14 on the IC chip 3 are aligned with soldering lands 7 on a printed wiring board 6; the chip is mounted by a soldering operation or the like. Fingers 2 which exist so as to correspond to pads 4 on the IC chip 3 are connected in advance to each other by using the same material as the fingers 2. As a result, after the TAB tape 1 on which the IC chip 3 has been mounted on the printed wiring board 6, it is not required that the soldering lands 7 to which the outer leads 14 of the fingers 2 connected to the pads 4 on the IC chip 3 have been soldered should be connected to each other. Thereby, a pattern interconnection density on the printed wiring board can be enhanced.