PURPOSE: To provide a TAB type semiconductor device in which the viscosity control of resin for protecting the surface of a pellet is facilitated while decreasing the resin thickness stably and preventing leakage of resin.

CONSTITUTION: The TAB type semiconductor device comprises a semiconductor pellet 1 having a wiring pattern and bump electrodes formed on the surface thereof, metal leads 3 each having an inner lead part 3a connected electrically on the bump electrode 4, a heat resistant sheet member 12 having a central hole 12a applied onto the metal leads 3 while covering the semiconductor pellet 1 from above, and a resin 13 for protecting the pellet poured through the hole 12a and filling the gaps between the sheet member 12 and the surface of the pellet 1.