TACKY ADHESIVE FILM FOR GRINDING BACK FACE OF SEMICONDUCTOR WAFER AND PROCESSING OF SEMICONDUCTOR WAFER USING THE FILM

Japanese Patent JP3693408

B2

PROBLEM TO BE SOLVED: To obtain the subject film having a tacky adhesive layer containing a specific amount of a cross-linking agent and a copolymer produced by the copolymerization of a mixture of specific amounts of monomers, giving little contamination on the surface of a semiconductor wafer and, if contaminated, removable with water.
SOLUTION: This tacky adhesive film is produced by coating a single surface of a substrate film with a tacky adhesive containing (A) 100 pts.wt. of a tacky adhesive polymer produced by the copolymerization of 100 pts.wt. of a monomer mixture containing (i) 67-98.9 pts.wt. of a main monomer preferably consisting of at least one kind of alkyl (meth)acrylate, (ii) 1-30 pts.wt. of a commoner having a functional group (preferably hydroxyl group or amino group) reactive with a cross-linking agent mentioned below and (iii) 0.1-3 pts.wt. of at least one kind of water-soluble comonomer selected from sulfosuccinic acid diester salts of formula I (R1 is an alkyl, an alkenyl, an alkylphenyl, etc.; R2 is H or methyl; A is a 2-3C alkylene; (n) is an integer of 0-100; M is a univalent cation) and formula II and (B) 0.3-15 pts.wt. of a cross-linking agent.

Fujii Yasuko
Yasuhisa Fujii
Makoto Kataoka
Kentaro Hirai

JP8496696A

September 07, 2005

April 08, 1996

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Mitsui Chemicals, Inc.

C09J7/02; C09J133/00; C09J163/00; C09J171/02; C09J175/04; H01L21/304; (IPC1-7): C09J7/02; H01L21/304

JP62101678A
JP63296222A

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